Layer |
||
| Item | English | |
|
Layers Count |
Up to 36 |
|
PCB Types |
||
|
Rigid Flex-Rigid Flex High-Density Interconnect (HDI) RF Microwave Hybrid Dielectric/Hybrid Materials Metal Core (MCPCB) |
||
| Item | English | |
|
Finished Thickness |
. 008"to. 500" |
|
|
Min Core Thickness |
. 003" |
|
|
Finished Thickness Tolerance |
5% |
|
|
Multiple Lamination Cycles |
7 |
|
|
Internal Copper Weight |
. 33 to 6 OZ |
|
|
External Copper Weight |
. 0.5 to 12 OZ |
|
Laminate Materials |
||
|
FR4 Tg 140 FR4 Tg 170 FR4 Tg 180 Getek Polyimide Rogers RF Taconic RF Arlon RF Duriod Shengyi&KB Halogen-Free Aluminum Backing Brass Backed Copper Backed Bergquist Laird C- LEC Plastic Speed Board Flexible Substrate |
||
Pad, Line&Spacing |
||
| Item | English | Metric System |
|
Outer Linew Width |
. 002" |
0.0508mm |
|
Outer Spacing |
. 002" |
0.0508mm |
|
Inner Line Width |
. 002" |
0.0508mm |
|
Internal Spacing |
. 002" |
0.0508mm |
|
Outer Pad Size-Annual Ring on Each Side |
. 003" |
0.0762mm |
|
Inner Pad Size-Ring on Each Side |
. 003" |
0.0762mm |
|
SMT Spacing |
. 02" |
0.508mm |
|
BGA Spacing |
. 02" |
0.508mm |
|
Impedance |
+/-2.5% |
|
Surface finish |
||
|
ENIG (electroless nickel-plated gold) Immersion Silver Immersion Tin HASL(60/40 Tin Lead) HAL Lead-Free Nickel (Electroplating) Palladium (Electroplating) Hard gold (Plating) Soft Gold OSP (Organic Surface Protection) Carbon Ink Selective Electroplating |
||
RoHS |
||
|
ENIG (electroless nickel-plated gold) Immersion silver Immersion Tin HAL Lead-Free OSP (organic surface protection) Cord solderable gold |
||
Vias |
||
|
Silver Conductive Via Filling Laser drilling Tented Vias Copper Conductive Via Filling Resin Via Filling Copper Plated Plugged Vias Automatic Planarization Capability |
||
| Item | English | |
|
Laser Micro Vias |
0.003" |
|
|
Blind Vias |
. 0063" |
|
|
Buried Vias |
. 0063" |
|
|
Mechanical Drill Vias |
. 0063" |
|
|
Tented Vias |
Coated/Plugged |
|
Routing/Scoring |
||
|
Scoring(Jump) Scoring(Jump) Min Length 1 " Scoring Web.014 +/- .003 Min Routing/Plated Edge Routing/Plated Pocket&Cutout Step Routing&Step Routing(Plating) Tab-Rounting Laser Rounting |
||
Soldermask |
||
|
LPI (Liquid Photo imagable Soldermask) Soldermask Color: Green/White/Red/Yellow/Black/Matte Soldmask Type: LPI&Dry Film Soldermask |
||
| Item | English | |
|
Min mask clearance (LPI) |
. 001" |
|
|
Min mask clearance (Dry Film) |
. 003" |
|
|
Min mask thickness (LPI) |
. 0004" |
|
|
Min mask thickness (Dry Film) |
. 003" |
|
|
Min mask Web (LPI) |
. 003" |
|
|
Min mask Web (Dry Film) |
. 008" |
|
Silkscreen/Legend |
||
|
Silkscreen/Legend Color: White/Black/Yellow/Red |
||
| Item | English | |
|
Silkscreen/Legend Feature Size |
. 008 "WX .030 H minimum |
|
Electrical Test |
||
|
Netlist testing Flying probe Test Fixture Netlist IPC-356A |
||
Controlled Impedance |
||
|
Controlled Impedance Testing TDR Tester (Polar Instruments) |
||
| Item | English | |
|
Impedance Tolerance (+/-) |
2.50% |
|
|
|
||
|
genesis 2000 Database ++ FTP Site |
||
Technology Capability
